Dr Ameer Janabi
Summary
Dr Ameer Janabi is a Senior Lecturer in the School of Electrical and Mechanical Engineering at the University of Portsmouth. His work focuses on power electronics, energy conversion, and reliable electrical systems.
Keywords: Power electronics, SiC devices, power converters, energy conversion, reliability.
Google Scholar: https://scholar.google.com/citations?user=gxyfYBQAAAAJ&hl=en
Teaching responsibilities
M24727 Electrical Machines and Drives
M31915 Advanced Battery and Fuel Cell Technologies
Research outputs
2026
Repairable, recyclable, and reliable power electronics using liquid metal interconnection
Mu, W., Janabi, A., Xiao, Z., Du, C., Shillaber, L., Long, T.
1 Mar 2026, In: IEEE Transactions on Power Electronics. 41, 3, p. 3171-3176, 6p.
Research output: Article
Towards the true zero-voltage-switching boundary
Ying, W., Janabi, A., Zhao, H., Qi, J., Mou, D., Jiang, C. Q., Li, H., Zhao, B., Long, T.
1 Jan 2026, In: IEEE Transactions on Power Electronics. 41, 1, p. 43-49, 7p.
Research output: Article
2025
A SiC half-bridge power module based on liquid metal packaging for high performance and low thermal stress
Mu, W., Janabi, A., Shillaber, L., Hu, B., Long, T.
1 May 2025,
Research output: Conference contribution
Digital twin of power modules based on physics informed machine learning
Hu, B., Mu, W., Zhu, H., Janabi, A., Ren, X., Li, D.
10 Feb 2025,
Research output: Conference contribution
The standard cell SiC die embedding high performance and scalable power electronics integration approach
Janabi, A., Shillaber, L., Ying, W., Mu, W., Hu, B., Ren, X.
10 Feb 2025,
Research output: Conference contribution
A passive self damping busbar to reduce DC-link ringing
Shillaber, L., Jiang, Y., Janabi, A., Mu, W., Long, T.
10 Feb 2025,
Research output: Conference contribution
2024
Substrate embedded power electronics packaging for silicon carbide MOSFETs
Janabi, A., Shillaber, L., Ying, W., Mu, W., Hu, B., Jiang, Y.
1 Aug 2024, In: IEEE Transactions on Power Electronics. 39, 8, p. 9614-9628
Research output: Article
Liquid metal fluidic connection and floating die structure for ultralow thermomechanical stress of SiC power electronics packaging
Mu, W., Janabi, A., Hu, B., Shillaber, L., Long, T.
1 Jul 2024, In: IEEE Transactions on Power Electronics. 39, 7, p. 7808-7814
Research output: Article
2023
Achieving low thermal stress in a PCB/AMB hybrid SiC power module using fluidic connections based on liquid metal
Mu, W., Janabi, A., Hu, B., Shillaber, L., Xiao, Z., Long, T.
29 Dec 2023,
Research output: Conference contribution